1. Start with material identity
Use when electrical or thermal conductivity and ductility control the project. Record the exact grade or purity basis, property target, test temperature and direction.
Use when the design needs a strength-conductivity balance or elevated-temperature stability. Record the exact alloy designation and requested heat-treatment condition.
2. Qualify the machine-material-process system
| Question | Evidence to request | Reason |
|---|---|---|
| Is the exact grade officially supported? | Current material data sheet and exact system configuration. | A generic copper claim may refer to an alloy, trial or retired portfolio. |
| What energy source is qualified? | Wavelength, rated power, calibration and parameter revision. | Copper melt behavior depends on the complete energy-delivery system. |
| How is powder controlled? | Lot, chemistry, oxygen, PSD method, flow/density method and reuse history. | Powder condition affects spreading, oxygen pickup and repeatability. |
| What is the acceptance build? | A representative part with channels, thin walls, machining and witness coupons. | Capability evidence should reproduce functional risk, not only a density cube. |
3. Internal-channel design gates
- State fluid, pressure, temperature, flow direction, pressure-drop limit, leak class and service environment.
- Show channel path, minimum section, transitions, manifolds and inlet/outlet interfaces in revision-controlled CAD.
- Define powder escape, cleaning method and evidence that residual powder has been removed.
- Mark machining datums, stock, sealing faces, threads and surfaces permitted to remain as-built.
- Agree CT or other NDT coverage, leak/pressure/flow tests and internal roughness requirements before quotation.
4. Four quality gates
Supplier, lot, chemistry, oxygen, PSD method, morphology, flow/density method, packaging and reuse.
System ID, calibration, gas flow, plate, parameter revision, operator, environment and build log.
Heat-treatment or HIP cycle, batch, support removal, machining, cleaning and finishing records.
FAI, NDT, conductivity or thermal evidence, leak/pressure/flow test and serial traceability.
5. Minimum RFQ package
- Controlled CAD, units and revision; critical dimensions, tolerances and assembly datums.
- Thermal/electrical duty, temperatures, loads, pressure, fluid, flow and leak requirement.
- Exact material identity, property priorities, powder restrictions and equivalence rules.
- Channel access and cleaning, post-processing, machining and inspection requirements.
- Prototype and annual quantity, delivery destination, milestones, NDA and documentation needs.
Prepare a review-ready package
Send controlled CAD and the completed requirements to Copper3DP RFQ review.
Selected evidence
ISO/ASTM 52900 fundamentals and vocabulary
ISO/ASTM 52908 post-processing, inspection and testing
NIST powder bed fusion research and metrology
ASTM B193 conductor resistivity